Handling


For best performance, it is best to solder the module directly onto a PCB by a solder reflow process. When placed in a (PLCC28) socket, the module may be subjected to mechanical stress by the springs in the socket, which might result in deteriorated performance.

 

Reflow specification

The moisture sensitivity level of the MTi 1-series modules corresponds to JEDEC MSL Level 3, see also:

The  sensor  fulfils  the  lead-free  soldering  requirements  of  the  above-mentioned  IPC/JEDEC standard, i.e. reflow soldering with a peak temperature up to 260 °C. Recommended Preheat Area (ts) is 80-100 sec. The minimum height of the solder after reflow should be at least 50 µm. This is required for good mechanical decoupling between the MTi 1-series module and the printed circuit board (PCB) it is mounted on.

 

The number of times that MEMS components may be reflowed is limited to three times. As the IMU is already reflowed once by Xsens in order to produce the MTi 1-series module, the MTi 1-series module may only be reflowed two times when placed on the PCB board. If the MTi 1-series is designed-in a double-sided PCB, it is recommended to reflow the side with the MTi 1-series in the second run in order to prevent large offsets.

 

For automated pick and placement of the MTi 1-series module, please be aware that the component placement on the module can differ between generations. See Design and Packaging.

 

Reflow classification profile (not to scale)

 

Ultrasonic processes

The MTi 1-series is sensitive to ultrasonic waves (e.g. ultrasonic cleaning/welding), which will damage the MTi-1 series module. Xsens will offer no warranty against damaged MTi 1-series modules caused by any ultrasonic processes.

 

Do not expose the MTi 1-series to ultrasonic processes!

 

Conformal coating

Conformal coating can influence the performance of the MTi 1-series due to mechanical stress. Most likely this will result in small sensor biases in the output signals of the module's gyroscopes and accelerometers. Tests with conformal coating carried out at Xsens have shown negligible changes in terms of sensor fusion performance.

 

 

Electrostatic discharge (ESD)

Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects at different electrical potentials caused by direct contact or induced by an electrostatic field. The term is usually used in the electronics and other industries to describe momentary unwanted currents that may cause damage to electronic equipment.

 

Create your own Knowledge Base